Staff/Senior System Architect, Time of Flight Sensor

Location: Silicon Valley office located in San Jose, CA; Open for remote
Type: Full-time


  • Silicon Valley office located in San Jose, CA; Open for remote
  • Starts: ASAP but negotiable
  • Salary: Base salary + Annual Bonus + 401K
  • US Green Card/Citizen (International traveling required). Open to H1B. No visa sponsorship.
  • Travel Frequency: up to 25%
  • Fluent in English, good Chinese as a plus


Our sensor team develops state of art sensors such as high performance Time of Flight products for different 3D sensing applications in consumer and industrial markets. The system architecture team pre-study of next generation product, define system architecture, develop new product proto & demos, and support our lead customers.

  • Understand, structure, and analyze application & system requirements for Time of Flight and 3D Imaging Sensors
  • Describe and own requirement engineering in application assumptions
  • Have technical meetings with lead customers worldwide to discuss and align system specifications for 3D Imaging solutions
  • Define and analyze new hardware concepts for our 3D imaging solutions and technically evaluate alternative concepts for new and emerging applications
  • Be familiar with signal processing of camera systems to make trade-offs between hardware and software implementations
  • Understand worldwide trends in standardization and assess technical impacts on the applications & systems to enrich the application roadmap
  • Provide technical content for the application roadmap as well as application descriptions and block level diagrams
  • Drive innovation ideas based on profound application and product understanding
  • Analyze key performance parameters of different depth sensor architectures
  • Contribute to overall imaging sensor architecture and depth sensing technology strategy


  • A Master's Degree or PhD in EE, optics or micro-technology related areas,
  • >7 years’ experience in depth sensing technologies
  • > 5 years of experience in hardware,  digital design, and semiconductor
  • Detailed theoretical understanding of depth sensing technologies, including time-of-flight and triangulation
  • Knowledge & experience in optoelectronic measurements
  • Strong desire to take a deep dive in 3D optoelectronic topics
  • Knowledge and experience with image signal processors (ISP) and digital image processing
  • Strong conceptual capabilities and the ability to cope with vague technical situations
  • Experience in imaging sensor & system design (e.g. product/system design for 2D/3D cameras, etc.)
  • Experience in requirements engineering
  • Knowledge in camera, embedded system design and interfaces (I2C, SPI, UART, MIPI, etc.)
  • Ability to bridge the gap between application & system know-how and product knowledge
  • Expertise in system flow down specifications from architecture to components
  • Analyze key performance parameters of different depth sensor architectures
  • Experience in documentation of imaging sensor requirements
  • Contribute to overall depth sensor architecture strategy
  • Overview depth sensing technology landscape
  • Competitive analysis of in-house versus 3rd party's technologies.
  • Outstanding analytical skills.


Desired Qualifications

  • Hands-on Experience in system architecture design for direct Time of Flight
  • Experience in circuit design and optical design.
  • Experience in single-photon avalanche diode (SPAD) design.
  • Experience in Vertical-Cavity Surface-Emitting Laser (VCSELs) design.

If you feel you are qualified for this position, please send your resume (and any supporting material if applicable) to: Tingting Guo at [email protected]

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