我们的高性能闪存产品具有各种容量和封装类型,可满足多样化的设计需求。联系我们了解有关闪存产品封装的更多信息。

SOP8 150mil
Length (Normal): 4.90 mm
Width (Normal): 6.00 mm
Thickness (Max): 1.75 mm
Pitch (Normal): 1.27 mm

SOP16 300mil
Length (Normal): 10.30 mm
Width (Normal): 10.35 mm
Thickness (Max): 2.75 mm
Pitch (Normal): 1.27 mm

SOP8 208mil
Length (Normal): 5.23 mm
Width (Normal): 7.90 mm
Thickness (Max): 2.16 mm
Pitch (Normal): 1.27 mm

TFBGA-24ball 6*8mm(6*4球阵列)
Length (Normal): 6.00 mm
Width (Normal): 8.00 mm
Thickness (Max): 1.20 mm
Pitch (Normal): 1.00 mm

VSOP8 150mil
Length (Normal): 4.90 mm
Width (Normal): 6.00 mm
Thickness (Max): 0.90 mm
Pitch (Normal): 1.27 mm

TFBGA-24ball 6*8mm(5*5球阵列)
Length (Normal): 6.00 mm
Width (Normal): 8.00 mm
Thickness (Max): 1.20 mm
Pitch (Normal): 1.00 mm

TSOP48
Length (Normal): 12.0 mm
Width (Normal): 20.0 mm
Thickness (Max): 1.20 mm
Pitch (Normal): 0.50 mm

LGA8 3*2mm
Length (Normal): 3.00 mm
Width (Normal): 2.00 mm
Thickness (Max): 0.50 mm
Pitch (Normal): 0.50 mm

VSOP8 208mil
Length (Normal): 5.28 mm
Width (Normal): 7.90 mm
Thickness (Max): 1.00 mm
Pitch (Normal): 1.27 mm

LGA8 8*6mm
Length (Normal): 8.00 mm
Width (Normal): 6.00 mm
Thickness (Max): 0.80 mm
Pitch (Normal): 1.27 mm

USON8 1.5*1.5mm
Length (Normal): 1.50 mm
Width (Normal): 1.50 mm
Thickness (Max): 0.50 mm
Pitch (Normal): 0.40 mm

USON8 4*4mm (0.45mm)
Length (Normal): 4.00 mm
Width (Normal): 4.00 mm
Thickness (Max): 0.50 mm
Pitch (Normal): 0.80 mm

USON8 3*2mm (0.45mm)
Length (Normal): 3.00 mm
Width (Normal): 2.00 mm
Thickness (Max): 0.50 mm
Pitch (Normal): 0.50 mm

WSON8 6*5mm
Length (Normal): 6.00 mm
Width (Normal): 5.00 mm
Thickness (Max): 0.80 mm
Pitch (Normal): 1.27 mm

USON8 3*4mm
Length (Normal): 3.00 mm
Width (Normal): 4.00 mm
Thickness (Max): 0.60 mm
Pitch (Normal): 0.80 mm

WSON8 8*6mm
Length (Normal): 8.00 mm
Width (Normal): 6.00 mm
Thickness (Max): 0.80 mm
Pitch (Normal): 1.27 mm

WLCSP 封装
取决于具体产品

FBGA63
Length (Normal): 9.00 mm
Width (Normal): 11.00 mm
Thickness (Max): 1.00 mm
Pitch (Normal): 0.80 mm
注意:以上图像仅供参考,未按比例绘制。所提供的尺寸均为典型的长度,宽度,间距和厚度。所有封装选项均可能会更改,可能不适用于所有产品。