-98.jpg)
Package Options
Overview
GigaDevice SPI NOR Flash provides an industry-leading selection of over 20 package options, offering unparalleled flexibility for diverse PCB layouts and environmental constraints. From ultra-compact Wafer Level Chip Scale Packaging (WLCSP) for space-constrained wearables to Known Good Die (KGD) for SiP (System-in-Package) integrations, our comprehensive portfolio ensures the perfect fit for your design.
Whether you require standard SOP and DFN footprints or robust BGA solutions for high-density automotive and industrial applications, GigaDevice’s packaging technology is engineered to optimize board space, enhance thermal performance, and accelerate your time-to-market.
Model
Length
Width
Height(Max)
Pitch
USON6 1.2*1.2 mm
1.20mm
1.20mm
0.40mm
0.40mm
USON8 1.5*1.5 mm
1.50 mm
1.50 mm
0.50 mm
0.40 mm
FO-USON8 3*2 mm
3.00 mm
2.00 mm
0.40 mm
0.50 mm
USON8 3*2 mm
3.00 mm
2.00 mm
0.50 mm
0.50 mm
FO-USON8 3*3 mm
3.00 mm
3.00 mm
0.40 mm
0.80 mm
USON8 3*4 mm
3.00 mm
4.00 mm
0.60 mm
0.80 mm
USON8 4*4 mm
4.00 mm
4.00 mm
0.50 mm
0.80 mm
SOP8 150 mil
4.90 mm
6.00 mm
1.75 mm
1.27 mm
SOP8 208 mil
5.23 mm
7.90 mm
2.16 mm
1.27 mm
WSON8 6*5 mm
6.00 mm
5.00 mm
0.80 mm
1.27 mm
WSON8 8*6 mm
8.00 mm
6.00 mm
0.80 mm
1.27 mm
SOP16 300mil
10.30 mm
10.35 mm
2.65 mm
1.27 mm
TSOP48
12.0 mm
20.0 mm
1.20 mm
0.50 mm
FBGA63
9.00 mm
11.0 mm
1.00 mm
0.80 mm
TFBGA-24ball 6*8 mm (4*6ball array)
6.00 mm
8.00 mm
1.20 mm
1.00 mm
VSOP8 150 mil
4.90 mm
6.00 mm
0.90 mm
1.27 mm
VSOP8 208 mil
5.28 mm
7.90 mm
1.00 mm
1.27 mm
