SPI NAND Flash
In 2013, GigaDevice launched the first low-pin count 8-pin SPI NAND Flash in the industry, and after years of development, it has achieved full product coverage in the fields of consumer electronics, industrial, networking, and automotive electronics.
SPI NAND Flash has an on-chip ECC and supports QSPI interface, that can support high speed, high reliability, and low power consumption.
Compared with the traditional parallel interface, it has the advantages of of using 8-pin small package size that share the same layout design as SPI NOR Flash and ease of integration due to similarity in hardware layout and firmware algorithm with Quad SPI support.
Since its launch, it has been widely adapted by designers as an important solution for their embedded application code and data storage.
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1.8V
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1Gb
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2Gb
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8Gb
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ECC Requirement
PackagesMP 3V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) S 3V 1Gb -40℃~85℃, -40℃~105℃ 166(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 3V 2Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 2Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 3V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 4Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 3V 4Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 3V 8Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 1Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 1Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) S 1.8V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 2Gb -40℃~85℃, -40℃~105℃ 80(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 2Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 4Gb -40℃~85℃, -40℃~105℃ 80(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 1.8V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 1.8V 8Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) -
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