GigaDevice Parallel NAND Flash products are compliant with ONFI 1.0 protocol.
This product can cover four density ranges of 1Gb~8Gb, use 3V/1.8V power supply, provide Octal/x16 IO interfaces, and supported on mainstream TSOP48 and BGA63 packages. Leveraging GigaDevice innovation, proven design philosophy, independent research and development, and stringent quality control standards, the Parallel NAND Flash products deliver high-speed performance, reliable, and diverse storage solutions tailored for industrial, communications, and consumer electronics.
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20 Results
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Voltage
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1.8V
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3V
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Density
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1Gb
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2Gb
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4Gb
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8Gb
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Part No
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Status
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Voltage
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Density
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Temperature (Industrial)
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I/O Bus
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Pagesize
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ECC Requirement
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Sequential Access Time
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Features
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Packages
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| MP | 3V | 1Gb | -40℃~85℃, -40℃~105℃ | x8 | 2K+128B | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+128B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 1Gb | -40℃~85℃, -40℃~105℃ | x8 | 2K+128B | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+128B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm |
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