WLCSP

GigaDevice's SPI NOR Flash and SPI NAND Flash are available in WLCSP (Wafer Level Chip Scale Packaging). Unlike conventional plastic packaging, WLCSP is a wafer-level chip packaging solution, providing a package size that is the same as the die size, it can achieve a length and width of less than 1mm, as thin as 0.25mm in thickness, and offers an unbeatable size advantage. WLCSP also enhances chip heat dissipation for improved data transfer stability.The ultra-compact size and low power consumption of GigaDevice’s WLCSP represents a breakthrough in the physical limits of memory chip, which is now extensively used in wearable applications. As the miniaturization market grows, WLCSP is set to become one of the key types of packages in the future.