Wireless Modules （Test）

Outstanding RF performance, high integration, and security assurance.

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Wireless Modules （Test）

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Overview

GigaDevice wireless modules help developers bring connected products to market faster with a scalable portfolio of high-performance Wi-Fi 6 and Bluetooth Low Energy (BLE 5.2) solutions. Built around the GD32VW553 RISC-V wireless MCU, these modules deliver up to 160 MHz processing performance, 4 MB integrated Flash, 320 KB SRAM, and advanced hardware security for secure IoT deployments.For customers migrating from established Wi-Fi module platforms, selected GD32VW553 modules offer pin-compatible footprints, enabling a seamless upgrade path to Wi-Fi 6 and BLE 5.2 while minimizing redesign effort and accelerating certification timelines.The module family supports a wide range of applications, from space-constrained consumer devices to industrial and mission-critical systems. Already deployed globally in EV charging infrastructure, robotics, smart building controls, and fire safety equipment, GD32VW553-based modules provide a proven, production-ready wireless platform. Customers can purchase today through Mouser for rapid prototyping and volume deployment.

GD32VW553-based Wifi Module Feature Highlight：

Featuring an ultra-mini footprint which delivers great deployment flexibility.
Combining Wi-Fi 6 and BLE in one module, it achieves globally competitive RF performance.
Engineered for exceptional reliability to withstand demanding environments.

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8 Results

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Product
- GD32VW553-UNIFI
- GD32VW553-MINI
Antenna Type
- Onboard
- External

Part No	Product	IEEE 802.11	Bluetooth	Core	Max Speed (MHz)	Flash (Bytes)	SRAM (Bytes)	I/O	Antenna Type	Module Size(mm)	Temperature
GD32VW553-UNIFI-IMH6	GD32VW553-UNIFI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 18	Onboard	24 x 16 x 2.2	-40 ~ 85℃
GD32VW553-UNIFI-IMH7	GD32VW553-UNIFI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 18	Onboard	24 x 16 x 2.2	-40 ~ 105℃
GD32VW553-UNIFI-EMH6	GD32VW553-UNIFI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 18	External	24 x 16 x 2.2	-40 ~ 85℃
GD32VW553-UNIFI-EMH7	GD32VW553-UNIFI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 18	External	24 x 16 x 2.2	-40 ~ 105℃
GD32VW553-MINI-IMK6	GD32VW553-MINI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 20	Onboard	15 x 12.4 x 2.4	-40 ~ 85℃
GD32VW553-MINI-IMK7	GD32VW553-MINI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 20	Onboard	15 x 12.4 x 2.4	-40 ~ 105℃
GD32VW553-MINI-EMK6	GD32VW553-MINI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 20	External	9.5 x 12.4 x 2.4	-40 ~ 85℃
GD32VW553-MINI-EMK7	GD32VW553-MINI	(b/g/n/ax) HT20	BLE 5.2	RISC-V	160	4096K	320K	up to 20	External	9.5 x 12.4 x 2.4	-40 ~ 105℃

Why Choose GigaDevice

Easy Wi-Fi 6 Migration

We offer complete module application manuals, quick-start guides, as well as hardware and software reference designs for the modules to help customers easily upgrade their existing solutions to Wi-Fi 6 modules.
Higher Performance, Same Footprint

Gain faster throughput, improved congestion handling, and lower power consumption while preserving existing hardware investments.
Industrial-Ready Reliability

Rated up to 105°C for demanding applications including EV charging, industrial automation, and smart infrastructure.
Security Built in

Integrated hardware cryptography accelerates secure boot, TLS, and OTA updates while reducing software overhead.
Proven at Scale

Millions of GD32VW553-based modules shipped annually, powering robotics, EV charging, home appliances and fire safety systems worldwide.

Explore Applications of GigaDevice Wireless Modules

Where to Buy

GigaDevice wireless modules are now available through Mouser, enabling fast sampling and seamless procurement for IoT development.
* Online purchasing and sample requests are currently limited to North America.

Resource Center

We are committed to providing efficient support for your product selection and development process. From initial selection through mass production, we streamline decision-making and accelerate project implementation.