-98.jpg)
EEPROM Package Options
Overview
GigaDevice I2C EEPROM offers a wide range of package options, fully meeting PCB design requirements across industrial control, smart metering, data center, and automotive electronics applications. This flexible packaging portfolio empowers customers to optimize board-level layouts, accelerate development cycles, and ensure long-term system stability.
Model
Length
Width
Height(Max)
Pitch
SOP8 150 mil
6.00 mm
4.90 mm
1.75 mm
1.27 mm
TSSOP8 173mil
6.40 mm
3.00 mm
1.20 mm
0.65 mm
UDFN8 2*3mm
3.00 mm
2.00 mm
0.60mm
0.50 mm
SOT23-5
2.92 mm
2.80 mm
1.25mm
0.95 mm
MSOP8 120 mil
4.90 mm
3.00 mm
1.10 mm
0.65 mm
