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WLCSP
Overview
GigaDevice WLCSP (Wafer Level Chip Scale Packaging) redefines the physical limits of memory storage, offering a near-zero footprint for the most space-constrained designs. Available across our SPI NOR and SPI NAND Flash portfolios (4Mb to 2Gb), our WLCSP solutions match the dimensions of the bare die, with ultra-thin profiles as low as 0.25mm and surface areas under 1mm².
Beyond mere miniaturization, WLCSP architecture significantly enhances thermal dissipation and signal integrity, ensuring stable data transmission in high-performance modules. By eliminating traditional plastic packaging, GigaDevice provides an unparalleled size-to-density ratio, making it the premier choice for next-generation wearables, IoT sensors, and slim mobile devices where every square millimeter counts.
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Voltage
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3V
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1.8V
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1Gb
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2Gb
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4Gb
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ECC Requirement
PackagesMP 3V 1Gb -40℃~85℃,-40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm,WSON8 6x5mm,WLCSP (4-4 ball array),TFBGA24 5x5 ball array MP 1.8V 1Gb -40℃~85℃,-40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm,WSON8 6x5mm,WLCSP (4-4 ball array),TFBGA24 5x5 ball array MP 3V 2Gb -40℃~85℃,-40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm,WSON8 6x5mm,WLCSP (4-4 ball array),TFBGA24 5x5 ball array MP 1.8V 2Gb -40℃~85℃,-40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm,WSON8 6x5mm,WLCSP (4-4 ball array),TFBGA24 5x5 ball array MP 3V 4Gb -40℃~85℃,-40℃~105℃ 133(x1 x2 x4) 4KB ECC-free WSON8 8x6mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array) MP 1.8V 4Gb -40℃~85℃,-40℃~105℃ 104(x1 x2 x4) 4KB ECC-free WSON8 8x6mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array) Status Legend: MP=Mass Production, UD=Under Development, S=Sample, NR=Not Recommend
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