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EEPROM 封装类型
Overview
GigaDevice EEPROM provides an industry-leading selection of multiple package options, offering unparalleled flexibility for diverse PCB layouts and environmental constraints. From ultra-compact Wafer Level Chip Scale Packaging (WLCSP) for space-constrained wearables to Known Good Die (KGD) for SiP (System-in-Package) integrations, our comprehensive portfolio ensures the perfect fit for your design.
Model
Length
Width
Height(Max)
Pitch
SOP8 150 mil
6.00 mm
4.90 mm
1.75 mm
1.27 mm
TSSOP8 173mil
6.40 mm
3.00 mm
1.20 mm
0.65 mm
UDFN8 2*3mm
3.00 mm
2.00 mm
0.60mm
0.50 mm
SOT23-5
2.92 mm
2.80 mm
1.25mm
0.95 mm
MSOP8 120 mil
4.90 mm
3.00 mm
1.10 mm
0.65 mm
