EEPROM已知良品芯片（KGD）

GigaDevice Known Good Die (KGD) products offer a high-performance bare die solution for advanced System-in-Package (SiP) and Multi-Chip Module (MCM) designs. Engineered for maximum integration, our KGD portfolio enables chipset vendors to drastically reduce system footprint and simplify complex hardware architectures by co-packaging EEPROM memory with primary controllers.

We ensure that every KGD product maintains the same rigorous quality and reliability standards as our industry-leading packaged ICs. By providing fully tested and screened bare die solutions, GigaDevice minimizes integration risks and optimizes manufacturing yields for high-density, space-constrained applications. Our dedicated technical support team is ready to provide professional guidance for your specific SiP requirements and Die-level integration challenges.