High Reliability
Compatible with the existing SPI interface specifications and operation modes, GigaDevice GD25/55T and GD25/55LT series provide guarantees for high-speed system design through DQS and DLP functions, and best ensure product reliability and high-speed I/O signal accuracy through the built-in ECC and CRC, significantly extending product lifetime.Fully compliant with the latest JEDEC xSPI and Xccela Consortium specifications, GD25/55X and GD25/55LX provide guarantees for high-speed system design through DQS and DLP functions, and best ensure product reliability and high-speed I/O signal accuracy through the built-in ECC and CRC, significantly extending the product lifetime. GigaDevice T/LT and X/LX series will be widely used in automotive and industrial applications with strict requirements on reliability.
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| Part NO. | Status | Voltage | Density | Frequency (MHz) | Features | Packages | Temperature |
|---|---|---|---|---|---|---|---|
| GD55X02GE | MP | 3V | 2Gb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LX02GE | MP | 1.8V | 2Gb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55X01GE | MP | 3V | 1Gb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LX01GE | MP | 1.8V | 1Gb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25X512ME | MP | 3V | 512Mb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LX512WE | MP | 1.8V | 512Mb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP, RWW |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LX512ME | MP | 1.8V | 512Mb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LX256E | MP | 1.8V | 256Mb |
166(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55T02GE | MP | 3V | 2Gb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# | TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55B02GF | S | 3V | 2Gb | 133(x1 x2 x4) |
Default 4I/O, H/W RESET,WP#, Secured OTP, Suspend, Unique ID | TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LT02GE | MP | 1.8V | 2Gb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# | TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55T01GE | MP | 3V | 1Gb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LT01GE | MP | 1.8V | 1Gb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25T512ME | MP | 3V | 512Mb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD55LT512WE | MP | 1.8V | 512Mb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET,WP#, RWW |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LT512ME | MP | 1.8V | 512Mb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LT256E | MP | 1.8V | 256Mb |
166(x1 x4), 200(x4 DTR) |
ECC,DTR,Default 4I/O, H/W RESET, WP# |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
