WLCSP
Realizing Unlimited Creativity in Limited Space
GigaDevice's SPI NOR Flash and SPI NAND Flash are available in WLCSP (Wafer Level Chip Scale Packaging). Unlike conventional plastic packaging, WLCSP is a wafer-level chip packaging solution, providing a package size that is the same as the die size, it can achieve a length and width of less than 1mm, as thin as 0.25mm in thickness, and offers an unbeatable size advantage. WLCSP also enhances chip heat dissipation for improved data transfer stability.The ultra-compact size and low power consumption of GigaDevice’s WLCSP represents a breakthrough in the physical limits of memory chip, which is now extensively used in wearable applications. As the miniaturization market grows, WLCSP is set to become one of the key types of packages in the future.
Key Information
SPI NOR Flash and SPI NAND Flash available in 4Mbit~2Gb WLCSP.
Product can be customized to meet the customer's unique product requirements.
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| Part NO. | Status | Voltage | Density | Temperature (Industrial) | Frequency (MHz) | Features | Packages |
|---|---|---|---|---|---|---|---|
| GD25NX128J | UD | 1.8V VCC, 1.2V VIO | 128Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
| GD25NX64J | UD | 1.8V VCC, 1.2V VIO | 64Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
| GD25LE256H | MP | 1.8V | 256Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
166(x1 x2 x4) 104(x4 DTR) |
DTR,H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
WSON8 6x5mm, WLCSP (4-4 ball array) |
| GD25WQ128H | MP | 1.65V~3.6V | 128Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
104(x1 x2 x4), 50(x4 DTR) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, , WLCSP (4-4 ball array) |
| GD25UF64E | MP | 1.2V | 64Mb |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
120(x1 x2 x4), 80(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 208mil, USON8 3x4mm, WLCSP (4-4 ball array) |
| GD25WQ64E | MP | 1.65V~3.6V | 64Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, WLCSP (3-2-3 ball array) |
| GD25WQ64H | MP | 1.65V~3.6V | 64Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
104(x1 x2 x4), 50(x4 DTR) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
FO-USON8 3x2mm, SOP8 150mil, SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array) |
| GD25LQ32E | MP | 1.8V | 32Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
| GD25LQ32D | NR | 1.8V | 32Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 120(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, WLCSP (4-4 ball array) |
| GD25LE32E | MP | 1.8V | 32Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
USON8 3x2mm, USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
| GD25LE32D | NR | 1.8V | 32Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 120(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array) |
| GD25LB32D | NR | 1.8V | 32Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 120(x1 x2 x4) |
Default 4I/O, S/W RESET, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, |
| GD25UF32E | S | 1.2V | 32Mb |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
| GD25LQ16E | MP | 1.8V | 16Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
| GD25LQ16C | NR | 1.8V | 16Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x4mm |
| GD25LE16E | MP | 1.8V | 16Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x2mm, WLCSP (3-2-3 ball array) |
| GD25LE16C | NR | 1.8V | 16Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID | SOP8 208mil |
| GD25LQ80C | NR | 1.8V | 8Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, WSON8 6x5mm, |
| GD25LE80E | MP | 1.8V | 8Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, USON8 3x2mm, WLCSP (4-4 ball array) |
| GD25LE80C | NR | 1.8V | 8Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, USON8 3x2mm, WLCSP (4-4 ball array) |
| GD25UF80E | S | 1.2V | 8Mb |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, WLCSP (4-4 ball array) |
| GD25WD40C | NR | 1.65V~3.6V | 4Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
100(x1), 80(x2) | WP#,Unique ID |
SOP8 150mil, USON8 1.5x1.5mm, USON8 3x2mm, WLCSP (4-4 ball array) |
| GD25WD20C | NR | 1.65V~3.6V | 2Mb |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
100(x1), 80(x2) | WP#,Unique ID |
SOP8 150mil, USON8 1.5x1.5mm, USON8 3x2mm, WLCSP (4-4 ball array) |
| GD25UF16E | S | 1.2V | 16Mb |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
