GD32F5HC

Overview
Product selector
Documentation

Overview

The GD32F5HC series MCUs are built on the Arm^® Cortex^®‑M33 core with a maximum operating frequency of 200 MHz.They integrate up to 2048 KB Flash, 320 KB SRAM, and 32 KB I‑Cache.Two package options are available: BGA64 and QFN56, with a minimum footprint of 4×4 mm. Key advantages include compact size, high operating frequency, large memory capacity, and strong security features,paired with ultra‑low power consumption and rich peripheral integration.These features ideally meet the requirements for miniaturized, high‑performance, and high‑security designs in consumer electronics, smart home, industrial control, and other applications,providing cost‑effective chip solutions for upgrading smart terminal products.

Product selector

Hide filter

Show filter

Reset

3 Results

Download to Excel

Part No	Core	Series	Package QFN56 BGA64	Max Speed (MHz)	Flash (Bytes)	SRAM (Bytes)	I/O up to 54 up to 50	GPTM (32bit)	GPTM (16bit)	Advanced TM (16bit)	Basic TM (16bit)	SysTick (24bit)	WDG	RTC	USART+UART	I2C	QSPI	SPI	I2S	USB 2.0	12bit ADC Units (CHs) 1(12) 1(11)	Temperature Range(TA) -40℃~85℃ -40℃~105℃
GD32F5HCRIL6	Cortex®-M33	GD32F5HC	BGA64	200	2048K	320K	up to 54	2	4	1	1	1	2	1	3	2	1	2	1	FS OTG	1(12)	-40℃~85℃
GD32F5HCPIQ6	Cortex®-M33	GD32F5HC	QFN56	200	2048K	320K	up to 50	2	4	1	1	1	2	1	3	2	1	2	1	FS OTG	1(11)	-40℃~85℃
GD32F5HCPIQ7	Cortex®-M33	GD32F5HC	QFN56	200	2048K	320K	up to 50	2	4	1	1	1	2	1	3	2	1	2	1	FS OTG	1(11)	-40℃~105℃