GD32E512/511/501 Series

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Overview

The GD32E512/511 series MCUs are powered by a high-performance Arm^® Cortex^®-M33 core running at up to 120 MHz and integrate a rich set of application-oriented peripherals, including 3×I2C, 1×MDIO, 2×ADC, 4×DAC, 2×COMP, 2×OPA and more. These integrated resources enable comprehensive monitoring and management functions for high-speed optical modules. The series also supports an ultra-compact 3 × 3 mm package, making it well suited to the increasing demand for miniaturization and higher integration in optical module designs.

The GD32E501 series MCUs are based on the Arm^® Cortex^®-M33 core operating at up to 100 MHz and feature a hardware multiplier/divider, a complete DSP instruction set, and a single-precision floating-point unit (FPU), delivering up to 126 DMIPS of processing performance. The series integrates 128 KB to 512 KB of dual-bank embedded Flash memory and 20 KB to 32 KB of SRAM, along with a rich set of peripherals that enhance data processing capabilities and provide flexible signal-chain resources. Operating from 1.8 V to 3.6 V across an industrial temperature range of -40°C to +105°C, the GD32E501 series supports Read-While-Write (RWW) functionality through its dual-bank Flash architecture, ensuring uninterrupted system operation during over-the-air (OTA) firmware updates. Additional features, including a Memory Protection Unit (MPU), Configurable Logic Array (CLA), I2C bootloader, and MDIO interface for Ethernet PHY management, further enhance system reliability, flexibility, and connectivity.

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GD32E501

Based on the Cortex®-M33 core, up to 100MHz operating frequency.
Integrated 512KB Flash and 32KB SRAM.
Support ADC, DAC, Comparators, CLA, MDIO and various of interfaces.
GD32E512

Equipped with Cortex®-M33 core, maximum frequency up to 120 MHz
512 KB Flash and 128 KB SRAM
Integrated abundant peripherals including I3C, I2C, ADC, DAC, Comparators, CLA, MDIO, etc.
GD32E511

Equipped with Cortex®-M33 core, maximum frequency up to 120 MHz
512 KB Flash and 128 KB SRAM
Integrated abundant peripherals including I3C, I2C, ADC, DAC, Comparators, CLA, MDIO, etc.

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Part No	Core	Series GD32E512 GD32E511 GD32E501	Package FCCSP81 FCCSP64 FCCSP49 BGA64	Max Speed (MHz) ≥ ≤	Flash (Bytes) 128K 256K 512K	SRAM (Bytes) 32K 64K 128K	I/O up to 55 38 51 54 65	GPTM (32bit)	GPTM (16bit)	Advanced TM (16bit)	Basic TM (16bit)	SysTick (24bit)	WDG	RTC	USART+UART 1+1 2	I2C	SPI ≥ ≤	I2S ≥ ≤	12bit ADC Units (CHs) 1(16) 2(22)　　 2(22)　 2(20)　 2(15)	12bit DAC Units ≥ ≤	Comp	Temperature Range(TA)
GD32E501REL7	Cortex®-M33	GD32E501	BGA64	100	512K	32K	up to 55	1	5	1	2	1	2	1	2	3	3	2	1(16)	8	2	-40℃~105℃
GD32E511RCL7	Cortex®-M33	GD32E511	BGA64	120	256K	64K	54	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃
GD32E511REL7	Cortex®-M33	GD32E511	BGA64	120	512K	128K	54	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃
GD32E512CBY7TR	Cortex®-M33	GD32E512	FCCSP49	120	128K	64K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512CCY7TR	Cortex®-M33	GD32E512	FCCSP49	120	256K	64K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512CEY7TR	Cortex®-M33	GD32E512	FCCSP49	120	512K	128K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512RCY7TR	Cortex®-M33	GD32E512	FCCSP64	120	256K	64K	51	1	5	1	2	1	2	1	1+1	3	4	0	2(20)	8	2	-40℃~105℃
GD32E512REY7TR	Cortex®-M33	GD32E512	FCCSP64	120	512K	128K	51	1	5	1	2	1	2	1	1+1	3	4	0	2(20)	8	2	-40℃~105℃
GD32E512MEY7TR	Cortex®-M33	GD32E512	FCCSP81	120	512K	128K	65	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃