GD32E512/511/501 Series

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Overview

The GD32E512/511 series MCUs feature an Arm^® Cortex^®-M33 high-performance core running at up to 120 MHz, and are integrated with abundant industry-specific peripherals, including 3×I2C, 1×MDIO, 2×ADC, 4×DAC, 2×COMP, 2×OPA and more. They realize integrated monitoring and management functions for high-speed optical modules. In addition, the series supports an ultra-compact 3×3 mm package, perfectly adapting to the miniaturization and high integration trend of optical modules.

The GD32E501 series Cortex^®-M33 MCUs have a maximum clock frequency of 100MHz, a built-in hardware multiplier/divider, and a complete DSP instruction set and a single-precision floating-point unit (FPU) to operate at the highest clock speed of 126DMIPS. They are equipped with 128KB to 512KB of dual-bank architecture embedded flash memory and 20KB to 32KB of SRAM. A rich set of peripherals is integrated on-chip to provide enhanced data processing capabilities and signal chain resources. The GD32E501 series of enhanced MCUs have a power supply voltage of 1.8-3.6V, an operating temperature range of -40°C to +105°C, and a built-in 512KB dual-bank flash memory that can support the use of RWW (Read while write) functions to ensure continuous execution during over-the-air (OTA) updates. Enhanced features such as the Memory Protection Unit (MPU), Programmable Logic Unit (CLA), I2C bootloader, and an MDIO interface used for Ethernet PHY management are also provided.

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GD32E501

Based on the Cortex®-M33 core, up to 100MHz operating frequency.
Integrated 512KB Flash and 32KB SRAM.
Support ADC, DAC, Comparators, CLA, MDIO and various of interfaces.
GD32E512

Equipped with Cortex®-M33 core, maximum frequency up to 120 MHz
512 KB Flash and 128 KB SRAM
Integrated abundant peripherals including I3C, I2C, ADC, DAC, Comparators, CLA, MDIO, etc.
GD32E511

Equipped with Cortex®-M33 core, maximum frequency up to 120 MHz
512 KB Flash and 128 KB SRAM
Integrated abundant peripherals including I3C, I2C, ADC, DAC, Comparators, CLA, MDIO, etc.

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Part No	Core	Series GD32E512 GD32E511 GD32E501	Package FCCSP81 FCCSP64 FCCSP49 BGA64	Max Speed (MHz) ≥ ≤	Flash (Bytes) 128K 256K 512K	SRAM (Bytes) 32K 64K 128K	I/O up to 55 38 51 54 65	GPTM (32bit)	GPTM (16bit)	Advanced TM (16bit)	Basic TM (16bit)	SysTick (24bit)	WDG	RTC	USART+UART 1+1 2	I2C	SPI ≥ ≤	I2S ≥ ≤	12bit ADC Units (CHs) 1(16) 2(22)　　 2(22)　 2(20)　 2(15)	12bit DAC Units ≥ ≤	Comp	Temperature Range(TA)
GD32E501REL7	Cortex®-M33	GD32E501	BGA64	100	512K	32K	up to 55	1	5	1	2	1	2	1	2	3	3	2	1(16)	8	2	-40℃~105℃
GD32E511RCL7	Cortex®-M33	GD32E511	BGA64	120	256K	64K	54	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃
GD32E511REL7	Cortex®-M33	GD32E511	BGA64	120	512K	128K	54	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃
GD32E512CBY7TR	Cortex®-M33	GD32E512	FCCSP49	120	128K	64K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512CCY7TR	Cortex®-M33	GD32E512	FCCSP49	120	256K	64K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512CEY7TR	Cortex®-M33	GD32E512	FCCSP49	120	512K	128K	38	1	5	1	2	1	2	1	1+1	3	4	0	2(15)	6	2	-40℃~105℃
GD32E512RCY7TR	Cortex®-M33	GD32E512	FCCSP64	120	256K	64K	51	1	5	1	2	1	2	1	1+1	3	4	0	2(20)	8	2	-40℃~105℃
GD32E512REY7TR	Cortex®-M33	GD32E512	FCCSP64	120	512K	128K	51	1	5	1	2	1	2	1	1+1	3	4	0	2(20)	8	2	-40℃~105℃
GD32E512MEY7TR	Cortex®-M33	GD32E512	FCCSP81	120	512K	128K	65	1	5	1	2	1	2	1	1+1	3	4	0	2(22)	8	2	-40℃~105℃