GD32® is a new 32-bit high performance, low power consumption universal microcontroller family powered by the ARM® Cortex®-M3 RISC core, which targeted at various MCU application areas. GD32® family integrates features to simplify system design and provide customers wide range of comprehensive and superior cost effective MCU portfolios with proven technology and great innovation. Building on GigaDevice advanced gFlash® memory technology and mass production experiences, it provides new form of MCUs which offers customer high functionality and quality. GD32® family includes entry line, performance line and connectivity line currently.

GD32^® MCU incorporates the 32-bit ARM^® Cortex^®-M3 processor core operating at 108 MHz max frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 3024 KB on-chip Flash memory and up to 96 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The device offers up to three 12-bit 1MSPS ADCs, up to ten general-purpose 16-bit timers plus one PWM advanced timer, as well as standard and advanced communication interfaces: up to three SPIs, two I2Cs, five USARTs, an USB 2.0 OTG FS and two CANs. The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C temperature range. Three power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications.

GD32^® series of MCUs also bring much advantage to the end-user. The max speed of GD32^® MCU has increased 50% than the market competing products. Code execution efficiency of the same frequency has enhanced 30%-40%. Current consumption of the same frequency has reduced 20%-30%. These performances provide maximum capability and bandwidth options for various market requirements.

The above features make the GD32^® MCUs suitable for a wide range of applications. It is ideal for use in industrial control, user interface, motor drives, power monitor and alarm systems, consumer and handheld equipment, solar photovoltaic control, touch panel, PC peripherals and so on.

Features

• Flexible memory configurations, with up to 3024 KB on-chip Flash memory and up to 96 KB SRAM memory
• Extensive range of enhanced I/Os and peripherals connected to two APB buses
• Wide range of standard and advanced communication interfaces,
  including SPI, I2C, USART, USB 2.0 OTG FS and CAN
• Up to three 12-bit 1Msps ADCs, up to ten general-purpose 16-bit timers, and one PWM advanced timer
• Three power saving modes for maximum optimization between wakeup latency and energy consumption for low-power applications